Processing methods and apparatus with temperature distribution control
US10002805B2 · kind B2 · utility
0Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2016 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Dec 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Wafer treatment process and apparatus is provided with a wafer carrier arranged to hold wafers and to inject a fill gas into gaps between the wafers and the wafer carrier. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.