Holding device and high-speed plating machine provided with the same
US10006137B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2014 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Jan 23, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Providing a holding device which can hold a plurality of types of workpieces and can reliably prevent a liquid in a liquid tank from leaking. The holding device includes a holding member configured to hold an article (workpiece) to be plated in a holding chamber. The article is disposed over a liquid tank in which a plating solution (liquid) flows and the holding chamber communicating with the liquid tank. The holding member has a plurality of abutting parts which closely abut against portions of an outer periphery of the article at a same level thereby to hold the article therebetween. The abutting parts are formed of a sponge sheet (elastic body) with chemical resistance. The holding device includes a pressurizing unit configured to supply air into the holding chamber to pressurize an atmosphere in the holding chamber while the article is held by the holding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.