Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process
US10008662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Mar 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B61/22
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a magnetoresistive random access memory (MRAM) device including a perpendicular MTJ (magnetic tunnel junction) is provided. The method includes forming a magnetic tunneling junction (MTJ) over a bottom electrode layer. A top electrode layer is formed over an upper surface of the MTJ, and a hard mask is formed over an upper surface of the top electrode layer. A first etch is performed through the top electrode layer, through regions of the MTJ unmasked by the hard mask, to form a top electrode and an etched MTJ. Sidewall spacers are formed extending from an upper surface of the hard mask or the top electrode, along sidewalls of the top electrode and the etched MTJ, to a point below or about even with an upper surface of the bottom electrode. A resulting MRAM device structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.