Patent · US Active

Packaging material and molded case

US10008700B2 · kind B2 · utility

3Cited by
3References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 9, 2014
Grant dateJun 26, 2018
Priority date
Expiry dateJul 28, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31678
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A packaging material 1 includes a heat resistant resin stretched film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between these layers, and a colored ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin stretched film layer 2. As the heat resistant resin stretched film, a heat resistant resin stretched film having a hot water shrinkage rate of 2% to 20% is used, and the heat resistant resin stretched film layer 2 and the colored ink layer 4 are integrally laminated via an easily adhesive layer 30. In this packaging material, at the time of forming and sealing, and even being used in a somewhat severe environment such as high-temperature and humid environment, the colored ink layer will not be detached from the heat resistant resin stretched film layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.