Inventor · Hikone, JP

Honglin Wang

13Patents
2h-index
29Co-inventors
50Inventor score

Filing activity: Oct 27, 2010 → Apr 20, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US10008700B2 Packaging material and molded case Emerging Cross-Sectional Technologies 3 Active
US9553284B2 Molding material for package Emerging Cross-Sectional Technologies 2 Active
US8748903B2 Semiconductor light emitting element and method for manufacturing semiconductor light emitting element Electricity 1 Active
US9812678B2 Molding packaging material Emerging Cross-Sectional Technologies 1 Active
US11264793B2 Method and device for quickly eliminating ferromagnetic resonance of voltage transformer Electricity 1 Active
US9649827B2 Molding packaging material and molded case Emerging Cross-Sectional Technologies 0 Active
US9725482B2 Pentacyclic triterpenoid compound with modified structure and preparation method and use thereof Human Necessities 0 Active
US11285206B2 Heat-resistant recombinant Newcastle Disease Virus vaccine strain capable of expressing truncated Fiber 2 protein of Fowl Adenovirus serotype 4, preparation method and application thereof Chemistry; Metallurgy 0 Active
US11583580B2 Heat-resistant H1N1 subtype influenza virus mutant strain, preparation method and application thereof Chemistry; Metallurgy 0 Active
US9051584B2 Heat-resistant newcastle disease virus live vaccine vector system and use thereof Chemistry; Metallurgy 0 Active
US11236107B2 Crystal of tricyclic compound Chemistry; Metallurgy 0 Active
US9252333B2 Semiconductor light emitting element and light emitting device Electricity 0 Active
US9276170B2 Semiconductor light emitting element and method of manufacturing semiconductor light emitting element Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.