Solder paste for bonding micro components
US10010979B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2013 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Oct 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.