Nihon Almit Co., Ltd.
4Patents
1Active
4Granted
28Portfolio score
Filing activity: May 25, 1984 → May 30, 2013
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6692691B2 | Pb-free soldering alloy | Performing Operations; Transporting | 4 | Expired |
| US5778964A | Solid spherical body manufacturing apparatus | Electricity | 4 | Expired |
| US10010979B2 | Solder paste for bonding micro components | Electricity | 2 | Active |
| US4533404A | Soldering fluxes | Performing Operations; Transporting | 2 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.