Copper electrodeposition bath containing an electrochemically inert cation
US10011914B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Sep 10, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Sep 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76873
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possible to increase the copper nucleation density. It also allows bottom-up filling in trenches that have a very small opening dimension, typically lower than 40 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.