Patent assignee · FR · COMPANY

ALCHIMER

21Patents
21Active
21Granted
50Portfolio score

Filing activity: Mar 22, 2005 → Sep 10, 2014 · 12 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US8133549B2 Method for modifying insulating or semi-conductive surfaces, and resulting products Chemistry; Metallurgy 6 Active
US8883641B2 Solution and method for activating the oxidized surface of a semiconductor substrate Electricity 4 Active
US7579274B2 Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices Chemistry; Metallurgy 2 Active
US8119542B2 Method of preparing an electrically insulating film and application for the metallization of vias Electricity 2 Active
US8298946B2 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits Emerging Cross-Sectional Technologies 2 Active
US9368397B2 Method for forming a vertical electrical connection in a layered semiconductor structure Electricity 1 Active
US8524512B2 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method Electricity 1 Active
US8574418B2 Electroplating method for coating a substrate surface with a metal Electricity 1 Active
US8591715B2 Electrodeposition composition and method for coating a semiconductor substrate using the said composition Electricity 0 Active
US10472726B2 Electrolyte and process for electroplating copper onto a barrier layer Chemistry; Metallurgy 0 Active
US9564333B2 Method for forming a metal silicide using a solution containing gold ions and fluorine ions Emerging Cross-Sectional Technologies 0 Active
US8405217B2 Coating method and solutions for enhanced electromigration resistance Electricity 0 Active
US8795503B2 Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate Emerging Cross-Sectional Technologies 0 Active
US8784635B2 Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces Chemistry; Metallurgy 0 Active
US9181623B2 Solution and process for activating the surface of a semiconductor substrate Electricity 0 Active
US10011914B2 Copper electrodeposition bath containing an electrochemically inert cation Electricity 0 Active
US7968653B2 Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained Chemistry; Metallurgy 0 Active
US9133560B2 Electroplating composition for coating a substrate surface with a metal Electricity 0 Active
US7956099B2 Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained Chemistry; Metallurgy 0 Active
US10460945B2 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure Electricity 0 Active
US9190283B2 Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.