Sensing chip
US10012646B2 · kind B2 · utility
0Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | May 25, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/553
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensing chip including a substrate, a plurality of metal nanostructures, a first surface modified layer and a second surface modified layer is provided. The metal nanostructures are disposed on the substrate. The first surface modified layer is disposed on a surface of the metal nanostructures, wherein the first surface modified layer includes a plurality of thiol group-containing molecules. The second surface modified layer is disposed on a surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.