Feng Kao
11Patents
0h-index
11Co-inventors
37Inventor score
Filing activity: Dec 30, 2015 → Jan 16, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11984393B2 | Electronic package, manufacturing method for the same, and electronic structure | Electricity | 0 | Active |
| US12009340B2 | Method for fabricating electronic package | Electricity | 0 | Active |
| US10723893B2 | Composite structure | Chemistry; Metallurgy | 0 | Active |
| US11326997B2 | Surface wettability determination method | Physics | 0 | Active |
| US11973047B2 | Electronic package including electronic structure and electronic component | Electricity | 0 | Active |
| US10012646B2 | Sensing chip | Physics | 0 | Active |
| US11152331B2 | Electronic package and method for fabricating the same | Electricity | 0 | Active |
| US12368116B2 | Electronic package and manufacturing method thereof | Electricity | 0 | Active |
| US12283560B2 | Electronic package including electronic structure and electronic body and manufacturing method thereof | Electricity | 0 | Active |
| US10006934B2 | Method for determining antifouling ability of a material surface and determining device for determining antifouling ability of material surface | Physics | 0 | Active |
| US11709133B2 | Solid surface wettability determination method | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.