Precision probe positioning for at-speed integrated circuit testing using through silicon in-circuit logic analysis
US10012692B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 9, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | May 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/3177
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method, system, and computer program product for precision probe positioning and testing of an integrated circuit. Methods, systems, and a computer program product implement techniques for determining a particular area of interest for precision probe positioning and testing where the particular area of interest comprises an area less than an entire area of the integrated circuit. Once the particular area of interest for testing has been determined, then a laser probe is steered or otherwise directed to illuminate a plurality of pixels within the area of interest so as to generate reflected signals corresponding to the illuminated pixels. Techniques are provided for measuring the reflected signals to determine information about the IC within the area of interest. CAD data or user data can be used to determine XY addressable pixel locations within the area of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.