Michael R. Bruce
81Patents
13h-index
36Co-inventors
80Inventor score
Filing activity: Nov 4, 1998 → Jun 9, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6549022B1 | Apparatus and method for analyzing functional failures in integrated circuits | Physics | 140 | Expired |
| US6608494B1 | Single point high resolution time resolved photoemission microscopy system and method | Physics | 113 | Expired |
| US6483327B1 | Quadrant avalanche photodiode time-resolved detection | Physics | 113 | Expired |
| US6488405B1 | Flip chip defect analysis using liquid crystal | Physics | 107 | Expired |
| US6391664B1 | Selectively activatable solar cells for integrated circuit analysis | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6850081B1 | Semiconductor die analysis via fiber optic communication | Physics | 21 | Expired |
| US6657446B1 | Picosecond imaging circuit analysis probe and system | Physics | 18 | Expired |
| US6897664B1 | Laser beam induced phenomena detection | Physics | 18 | Expired |
| US6281025A | Substrate removal as a function of SIMS analysis | Electricity | 18 | Expired |
| US6709985B1 | Arrangement and method for providing an imaging path using a silicon-crystal damaging laser | Electricity | 16 | Expired |
| US6417680B1 | Method and apparatus for stress testing a semiconductor device using laser-induced circuit excitation | Physics | 15 | Expired |
| US6994584B1 | Thermally conductive integrated circuit mounting structures | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6146014A | Method for laser scanning flip-chip integrated circuits | Physics | 13 | Expired |
| US6375347B1 | Method for laser scanning flip-chip integrated circuits | Physics | 13 | Expired |
| US6387715B1 | Integrated circuit defect detection via laser heat and IR thermography | Physics | 12 | Expired |
| US6403388B1 | Nanomachining method for integrated circuits | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6780664B1 | Nanotube tip for atomic force microscope | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6500699B1 | Test fixture for future integration | Electricity | 9 | Expired |
| US6546513B1 | Data processing device test apparatus and method therefor | Physics | 8 | Expired |
| US6430728B1 | Acoustic 3D analysis of circuit structures | Physics | 8 | Expired |
| US6541987B1 | Laser-excited detection of defective semiconductor device | Physics | 8 | Expired |
| US6483326B1 | Localized heating for defect isolation during die operation | Physics | 7 | Expired |
| US6303396A | Substrate removal as a function of resistance at the back side of a semiconductor device | Electricity | 7 | Expired |
| US7088852B1 | Three-dimensional tomography | Physics | 7 | Expired |
| US6469529B1 | Time-resolved emission microscopy system | Physics | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.