Method and device for bonding substrates
US10014193B2 · kind B2 · utility
3Cited by
1References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Feb 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.