EV GROUP E. THALLNER GMBH
174Patents
174Active
174Granted
60Portfolio score
Filing activity: Nov 7, 2008 → Dec 19, 2022 · 10 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9194700B2 | Device and method for reducing a wedge error | Physics | 22 | Active |
| US8640548B2 | Apparatus, device and method for determining alignment errors | Electricity | 21 | Active |
| US9312161B2 | Accommodating device for retaining wafers | Electricity | 19 | Active |
| US9296193B2 | Bendable carrier mount, device and method for releasing a carrier substrate | Emerging Cross-Sectional Technologies | 17 | Active |
| US9613840B2 | Apparatus and method for bonding substrates | Emerging Cross-Sectional Technologies | 11 | Active |
| US9640510B2 | Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas | Electricity | 9 | Active |
| US10024741B2 | Measuring device and method for ascertaining a pressure map | Physics | 9 | Active |
| US10109487B2 | Method for bonding substrates | Electricity | 8 | Active |
| US9418882B2 | Device and method for aligning substrates | Electricity | 6 | Active |
| US8975158B2 | Method for permanently bonding wafers | Electricity | 6 | Active |
| US9576825B2 | Device for alignment of two substrates | Electricity | 6 | Active |
| US9067363B2 | Method and device for permanent bonding of wafers, as well as cutting tool | Emerging Cross-Sectional Technologies | 6 | Active |
| US9851645B2 | Device and method for aligning substrates | Electricity | 6 | Active |
| US10279575B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 6 | Active |
| US10325798B2 | Accommodating device for retaining wafers | Electricity | 6 | Active |
| US10008424B2 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack | Electricity | 6 | Active |
| US11282706B2 | Device and method for bonding of substrates | Electricity | 5 | Active |
| US9859246B2 | Method for bonding substrates | Electricity | 5 | Active |
| US9707650B2 | System and method for machining a workpiece | Emerging Cross-Sectional Technologies | 5 | Active |
| US9666470B2 | Receptacle device, device and method for handling substrate stacks | Electricity | 4 | Active |
| US10388545B2 | Device for alignment of two substrates | Electricity | 4 | Active |
| US10438822B2 | Method for prefixing of substrates | Electricity | 3 | Active |
| US10943807B2 | Method and device for alignment of substrates | Electricity | 3 | Active |
| US10964562B2 | Device and method for bonding of two substrates | Electricity | 3 | Active |
| US9159717B2 | Method for permanently bonding wafers | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.