Method and apparatus to assist the processing of deformed substrates
US10014228B2 · kind B2 · utility
0Cited by
10References
18Claims
0Family size
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Key dates
| Filing date | Nov 18, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Aug 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.