Modular semiconductor package
US10015882B1 · kind B1 · utility
6Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2015 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jul 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein relate generally to a microelectronic packaging and the manufacture thereof. A carrier may have a die attached to a top face thereof. A printed circuit board may be attached to the top face of the carrier. The printed circuit board may have a hole in which the die is disposed. A lid may be attached to the printed circuit board opposite the carrier so that the die is enclosed by the carrier, the printed circuit board, and the lid. The printed circuit board may form a seal ring around the die. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.