Inventor · Bend, OR, US

Dylan Murdock

16Patents

1h-index

8Co-inventors

39Inventor score

Filing activity: Jan 5, 2015 → May 18, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10015882B1	Modular semiconductor package	Electricity	6	Active
US9911678B2	Substrate with integrated heat spreader	Electricity	1	Active
US11564337B2	Thermal structures for heat transfer devices and spatial power-combining devices	Emerging Cross-Sectional Technologies	0	Active
US10976108B2	Heat exchanger assemblies for electronic devices	General	0	Revoked
US10418257B1	Environmentally robust plating configuration for metal-diamond composites substrate	Electricity	0	Active
US11255608B2	Heat exchanger assemblies for electronic devices	Mechanical Engineering; Lighting; Heating	0	Active
US10855240B2	Structures for spatial power-combining devices	Electricity	0	Active
US10539371B2	Heat transfer device incorporating a helical flow element within a fluid conduit	Mechanical Engineering; Lighting; Heating	0	Active
US11162734B2	Heat exchanger assemblies for electronic devices and related methods	Electricity	0	Active
US11621469B2	Power-combining devices with increased output power	Electricity	0	Active
US11346562B1	Safety gate for a stove	Mechanical Engineering; Lighting; Heating	0	Active
US12266582B2	Hermetic package for high CTE mismatch	Electricity	0	Active
US12119281B2	Hermetic package for high CTE mismatch	Electricity	0	Active
US11791251B2	High power laminate RF package	Electricity	0	Active
US11955687B2	Structural arrangements for spatial power-combining devices	Electricity	0	Active
US11665867B2	Thermal structures for heat transfer devices and spatial power-combining devices	Emerging Cross-Sectional Technologies	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.