Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die
US10015916B1 · kind B1 · utility
40Cited by
13References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 21, 2013 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Mar 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors for coupling an integrated circuit die to the interposer to provide a stacked die. The interposer includes a pad coupled to a conductive network of the interposer to dissipate electrostatic charge from the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.