Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser

US10017375B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Reichenbach · Wannweil, DE
• Till Schade · Kempten, DE
• Jochen Reinmuth · Reutlingen, DE
• Philip Kappe · Stuttgart, DE
• Alexander Ilin · Ludwigsburg, DE
• Mawuli Ametowobla · Stuttgart, DE
• Julia Amthor · Reutlingen, DE

Key dates

• Filing date: Oct 12, 2016
• Grant date: Jul 10, 2018
• Expiry date: Oct 12, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0145
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method is provided for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or in the cap. The first pressure and/or the first chemical composition are adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for reducing local stresses occurring at a sealed access opening.