Frank Reichenbach
22Patents
5h-index
48Co-inventors
69Inventor score
Filing activity: Dec 14, 2000 → Jan 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6936902B2 | Sensor with at least one micromechanical structure and method for production thereof | Performing Operations; Transporting | 19 | Expired |
| US7834409B2 | Micromechanical component and corresponding method for its manufacture | Electricity | 9 | Active |
| US8637945B2 | Component having a micromechanical microphone structure, and method for its production | Emerging Cross-Sectional Technologies | 7 | Active |
| US8698255B2 | Semiconductor component having a micromechanical microphone structure | Electricity | 6 | Active |
| US6955975B2 | Method for joining a silicon plate to a second plate | Electricity | 5 | Expired |
| US9890035B2 | Method for manufacturing a micromechanical component | Performing Operations; Transporting | 3 | Active |
| US10029911B2 | Micromechanical component including a diffusion stop channel | Performing Operations; Transporting | 3 | Active |
| US9277586B2 | Method for reassigning the role of a wireless node in a wireless network | Electricity | 3 | Active |
| US8329555B2 | Method for producing a capping wafer for a sensor | Electricity | 3 | Active |
| US7273764B2 | Sensor with at least one micromechanical structure, and method for producing it | Performing Operations; Transporting | 2 | Expired |
| US9632860B2 | Multicore processor fault detection for safety critical software applications | Physics | 1 | Active |
| US10017375B2 | Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser | Performing Operations; Transporting | 1 | Active |
| US7564033B2 | Microstructured sensor | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10556789B2 | Laser resealing with stress-reducing prestructuring | Performing Operations; Transporting | 0 | Active |
| US12404170B2 | Method for producing a bonding pad for a micromechanical sensor element | Performing Operations; Transporting | 0 | Active |
| US9927497B2 | Sensor apparatus, production method for a sensor apparatus having at least one magnetic core and method for determining a field strength of a magnetic field in at least one spatial direction | Physics | 0 | Active |
| US8963777B2 | Method and node for localizing a node in a wireless network | Electricity | 0 | Active |
| US10023460B2 | Structures for reducing and avoiding stresses on the seal bottom side during laser reseal | Performing Operations; Transporting | 0 | Active |
| US7495328B2 | Micromechanical component | Electricity | 0 | Active |
| US10963357B2 | Fault monitoring for a complex computing unit | Physics | 0 | Active |
| US10183861B2 | Laser reseal including a protective structure | Performing Operations; Transporting | 0 | Active |
| US10000375B2 | Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.