Wafer-level molding chase design
US10020211B2 · kind B2 · utility
2Cited by
39References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jul 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus includes a mold chase, which includes a top portion and an edge ring having a ring-shape. The edge ring is underlying and connected to an edge of the top portion. The edge ring has an injection port and a venting port. A molding guide kit is configured to be inserted into the injection port. The molding guide kit includes a front sidewall having a curved front edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.