Semiconductor package and manufacturing method thereof
US10020263B2 · kind B2 · utility
3Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2016 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.