Patent assignee · US · COMPANY

Amkor Technology, Inc.

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1,032Patents
591Active
1,032Granted
60Portfolio score

Filing activity: Apr 24, 1996 → Dec 2, 2019 · 197 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6303997A Thin, stackable semiconductor packages Electricity 437 Expired
US6281568A Plastic integrated circuit device package and leadframe having partially undercut leads and die pad Emerging Cross-Sectional Technologies 366 Expired
US6143981A Plastic integrated circuit package and method and leadframe for making the package Emerging Cross-Sectional Technologies 364 Expired
US7777351B1 Thin stacked interposer package Electricity 347 Active
US6577013B1 Chip size semiconductor packages with stacked dies Electricity 334 Expired
US7185426B1 Method of manufacturing a semiconductor package Emerging Cross-Sectional Technologies 334 Expired
US7633765B1 Semiconductor package including a top-surface metal layer for implementing circuit features Electricity 332 Active
US6395578B1 Semiconductor package and method for fabricating the same Electricity 311 Expired
US5866939A Lead end grid array semiconductor package Electricity 296 Expired
US6943429B1 Wafer having alignment marks extending from a first to a second surface of the wafer Electricity 284 Expired
US7042072B1 Semiconductor package and method of manufacturing the same which reduces warpage Electricity 282 Expired
US5981314A Near chip size integrated circuit package Electricity 245 Expired
US6624005B1 Semiconductor memory cards and method of making same Electricity 235 Expired
US7843072B1 Semiconductor package having through holes Electricity 227 Active
US6686649B1 Multi-chip semiconductor package with integral shield and antenna Electricity 225 Expired
US6571466B1 Flip chip image sensor package fabrication method Emerging Cross-Sectional Technologies 224 Expired
US6329606A Grid array assembly of circuit boards with singulation grooves Emerging Cross-Sectional Technologies 222 Expired
US6448633B1 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant Electricity 212 Expired
US6369454B1 Semiconductor package and method for fabricating the same Electricity 212 Expired
US7671457B1 Semiconductor package including top-surface terminals for mounting another semiconductor package Emerging Cross-Sectional Technologies 209 Active
US6930256B1 Integrated circuit substrate having laser-embedded conductive patterns and method therefor Emerging Cross-Sectional Technologies 203 Expired
US6531784B1 Semiconductor package with spacer strips Electricity 202 Expired
US6150193A RF shielded device Electricity 201 Expired
US9653428B1 Semiconductor package and fabricating method thereof Electricity 200 Active
US6555917B1 Semiconductor package having stacked semiconductor chips and method of making the same Electricity 197 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.