Printed circuit board and method of manufacturing the same
US10021785B2 · kind B2 · utility
1Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0514
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.