Hye Won Jung
7Patents
1h-index
15Co-inventors
40Inventor score
Filing activity: Apr 21, 2015 → Nov 5, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9793250B2 | Package board, method for manufacturing the same and package on package having the same | Electricity | 2 | Active |
| US10021785B2 | Printed circuit board and method of manufacturing the same | Electricity | 1 | Active |
| US10849226B2 | Printed circuit board and method of manufacturing the same | Electricity | 1 | Active |
| US10779409B2 | Printed circuit board | Electricity | 0 | Active |
| US9554466B2 | Printed circuit board and method of manufacturing the same | Electricity | 0 | Active |
| US11315718B2 | Coil component and method for manufacturing the same | Electricity | 0 | Active |
| US11476034B2 | Coil electronic component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.