Patent · US Active

High purity refractory metal powders and their use in sputtering targets which may have random texture

US10023953B2 · kind B2 · utility

0Cited by

11References

8Claims

0Family size

Assignee

H.C. STARCK INC. · US

Inventors

Patrick Hogan · Somerville, US
Paul R. Aimone · Bridgewater, US
Joseph Flanigan · Hudson, US
Marcel Hagymasi · Goslar, DE
Helmut Haas · Achim, DE

Key dates

Filing date	Apr 8, 2015
Grant date	Jul 17, 2018
Priority date	—
Expiry date	Aug 25, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB22F2003/1014
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 μm, with at least about 10 percent by weight of particles having a particle size greater than about 150 μm (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 μm), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.