Patrick Hogan
21Patents
5h-index
16Co-inventors
62Inventor score
Filing activity: Jun 30, 2010 → Jun 13, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10668566B2 | Fabrication of high-entropy alloy wire and multi-principal element alloy wire | Emerging Cross-Sectional Technologies | 24 | Active |
| US11077524B2 | Additive manufacturing utilizing metallic wire | Emerging Cross-Sectional Technologies | 22 | Active |
| US9017762B2 | Method of making molybdenum-containing targets comprising three metal elements | Emerging Cross-Sectional Technologies | 9 | Active |
| US8449818B2 | Molybdenum containing targets | Emerging Cross-Sectional Technologies | 5 | Active |
| US9299472B2 | Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays | Emerging Cross-Sectional Technologies | 5 | Active |
| US8449817B2 | Molybdenum-containing targets comprising three metal elements | Emerging Cross-Sectional Technologies | 5 | Active |
| US9945023B2 | Touch screen device comprising Mo-based film layer and methods thereof | Emerging Cross-Sectional Technologies | 3 | Active |
| US9929187B2 | Copper-alloy capping layers for metallization in touch-panel displays | Emerging Cross-Sectional Technologies | 2 | Active |
| US9455283B2 | Etch chemistries for metallization in electronic devices | Physics | 2 | Active |
| US9837253B2 | Molybdenum containing targets for touch screen device | Emerging Cross-Sectional Technologies | 2 | Active |
| US10916569B2 | Thin-film transistor and method of forming an electrode of a thin-film transistor | Emerging Cross-Sectional Technologies | 2 | Active |
| US10923514B2 | Etch chemistries for metallization in electronic devices | Physics | 1 | Active |
| US11392257B2 | Copper-alloy capping layers for metallization in touch-panel displays | Emerging Cross-Sectional Technologies | 1 | Active |
| US10186530B2 | Etch chemistries for metallization in electronic devices | Physics | 1 | Active |
| US10023953B2 | High purity refractory metal powders and their use in sputtering targets which may have random texture | Performing Operations; Transporting | 0 | Active |
| US11640222B2 | Copper-alloy capping layers for metallization in touch-panel displays | Emerging Cross-Sectional Technologies | 0 | Active |
| US11753702B2 | Molybdenum containing targets | Emerging Cross-Sectional Technologies | 0 | Active |
| US10403483B2 | Molybdenum containing targets | Emerging Cross-Sectional Technologies | 0 | Active |
| US10829849B2 | Molybdenum containing targets | Emerging Cross-Sectional Technologies | 0 | Active |
| US11198197B2 | Fabrication of high-entropy alloy wire and multi-principal element alloy wire | Emerging Cross-Sectional Technologies | 0 | Active |
| US9150955B2 | Method of making molybdenum containing targets comprising molybdenum, titanium, and tantalum or chromium | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.