Smart selection and/or weighting of parameters for lithographic process simulation
US10025198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2009 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Jan 30, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70666
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention generally relates to simulating a lithographic process, and more particularly to methods for smart selection and smart weighting when selecting parameters and/or kernels used in aerial image computation. According to one aspect, advantages in simulation throughput and/or accuracy can be achieved by selecting TCC kernels more intelligently, allowing highly accurate aerial images to be simulated using a relatively fewer number of TCC kernels than in the state of the art. In other words, the present invention allows for aerial images to be simulated with the same or better accuracy using much less simulation throughput than required in the prior art, all else being equal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.