Electronic component, method for producing same, and sealing material paste used in same
US10026923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2017 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Jun 28, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently. V2O5+TeO2+Fe2O3+P2O5≥90 (mass %) (1)V2O5>TeO2>Fe2O3>P2O5 (mass %) (2)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.