Inventor · Tokyo, JP

Kei Yoshimura

19Patents
4h-index
23Co-inventors
56Inventor score

Filing activity: Feb 6, 2009 → Nov 1, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US8470723B2 Low softening point glass composition, bonding material using same and electronic parts Emerging Cross-Sectional Technologies 16 Active
US8367573B2 Glass composition and its applications Emerging Cross-Sectional Technologies 9 Active
US9556061B2 Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same Emerging Cross-Sectional Technologies 6 Active
US9670090B2 Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same Emerging Cross-Sectional Technologies 4 Active
US9048056B2 Glass composition and covering and sealing members using same Emerging Cross-Sectional Technologies 4 Active
US8337723B2 Electroconductive material and positive electrode material for lithium ion secondary battery using the same Emerging Cross-Sectional Technologies 3 Active
US8895460B2 Glass composition, electrically conductive paste composition comprising same, electrode wiring member, and electronic component Emerging Cross-Sectional Technologies 3 Active
US9786463B2 Electronic component, conductive paste, and method for manufacturing an electronic component Emerging Cross-Sectional Technologies 2 Active
US8685872B2 Low softening point glass composition, bonding material using same and electronic parts Emerging Cross-Sectional Technologies 2 Active
US8951436B2 Positive electrode active material Emerging Cross-Sectional Technologies 2 Active
US9950948B2 Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same Emerging Cross-Sectional Technologies 1 Active
US9728341B2 Electronic component, method for producing same, and sealing material paste used in same Emerging Cross-Sectional Technologies 1 Active
US9614178B2 Electronic component, process for producing same, sealing material paste, and filler particles Emerging Cross-Sectional Technologies 0 Active
US10358379B2 Heat-insulating member, low-melting glass composition, and sealing material paste Emerging Cross-Sectional Technologies 0 Active
US11542192B2 Sealing material and multilayered glass panel using same Emerging Cross-Sectional Technologies 0 Active
US10026923B2 Electronic component, method for producing same, and sealing material paste used in same Emerging Cross-Sectional Technologies 0 Active
US10259740B2 Multi-layer glass and method for producing the same Emerging Cross-Sectional Technologies 0 Active
US9142708B2 Glass composition and conductive paste for aluminum electrode wiring, electronic component provided with that aluminum electrode wiring and method for producing this electronic component Emerging Cross-Sectional Technologies 0 Active
US10449622B2 Conductive joint article and method for manufacturing same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.