Stencil set and system for printing solder paste for printed circuit boards
US10028392B2 · kind B2 · utility
0Cited by
22References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2016 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Aug 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.