John Andrew Trelford
8Patents
1h-index
8Co-inventors
40Inventor score
Filing activity: Oct 12, 2012 → Jan 2, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10993325B2 | Interposer printed circuit boards for power modules | Electricity | 4 | Active |
| US10028392B2 | Stencil set and system for printing solder paste for printed circuit boards | Electricity | 0 | Active |
| US11792928B2 | Printed circuit boards with plated blind slots for improved vertical electrical and/or thermal connections | Electricity | 0 | Active |
| US11490517B2 | Interposer printed circuit boards for power modules | Electricity | 0 | Active |
| US11910517B2 | Point of load module and heatsink therefor | Electricity | 0 | Active |
| US9426901B2 | Patterning method for component boards | Electricity | 0 | Active |
| US12309910B2 | Point of load module and heatsink therefor | Electricity | 0 | Active |
| US11439013B2 | Interposer printed circuit boards for power modules | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.