Thermosetting resin composition and use thereof
US10029438B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Dec 23, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jul 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31605
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.