SHENGYI TECHNOLOGY CO., LTD.
68Patents
68Active
68Granted
55Portfolio score
Filing activity: Sep 2, 2011 → Jul 27, 2022
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10144824B2 | Halogen free resin composition and prepreg and laminated board prepared therefrom | Electricity | 6 | Active |
| US10240074B2 | Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor | Chemistry; Metallurgy | 3 | Active |
| US9873789B2 | Halogen-free epoxy resin composition, prepreg and laminate using same | Chemistry; Metallurgy | 3 | Active |
| US10299378B2 | Polymer resin composition, polyimide resin film, preparation method of polyimide resin film, flexible metal laminate, and circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US11930595B2 | Circuit material and circuit board containing the same | Electricity | 1 | Active |
| US10030143B2 | Ceramized silicone resin composition and pre-preg and laminate that use the composition | Performing Operations; Transporting | 1 | Active |
| US9139750B2 | Halogen-free resin composition and method for preparation of copper clad laminate with same | Emerging Cross-Sectional Technologies | 1 | Active |
| US10645806B2 | Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate | Chemistry; Metallurgy | 1 | Active |
| US10544255B2 | Epoxy resin composition, prepreg and laminate prepared therefrom | Chemistry; Metallurgy | 1 | Active |
| US8889816B2 | Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight | Electricity | 1 | Active |
| US11661378B2 | Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof | Chemistry; Metallurgy | 0 | Active |
| US9062011B2 | Benzoxazine intermediate and preparation method thereof | Chemistry; Metallurgy | 0 | Active |
| US12122904B2 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same | Chemistry; Metallurgy | 0 | Active |
| US10112368B2 | Flexible metal laminate and preparation method of the same | Performing Operations; Transporting | 0 | Active |
| US11649351B2 | Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same | Chemistry; Metallurgy | 0 | Active |
| US10696844B2 | Halogen-free flame retardant type resin composition | Electricity | 0 | Active |
| US10208156B2 | Epoxy resin composition, prepreg and laminate using same | Electricity | 0 | Active |
| US11744013B2 | Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same | Electricity | 0 | Active |
| US10280343B2 | Adhesive resin composition, adhesive film, and flexible metal laminate | Electricity | 0 | Active |
| US11584851B2 | Resin composition, and prepreg and circuit material using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10513605B2 | Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same | Chemistry; Metallurgy | 0 | Active |
| US9771479B2 | Halogen-free resin composition and use thereof | Electricity | 0 | Active |
| US11970591B2 | Resin composition, prepreg for printed circuit and metal-coated laminate | Electricity | 0 | Active |
| US11319397B2 | Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board | Electricity | 0 | Active |
| US9611377B2 | Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.