Die mounting system and die mounting method
US10032650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Mar 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.