Inventor · Osaka, JP

Yukinori Nakayama

25Patents
2h-index
23Co-inventors
53Inventor score

Filing activity: Apr 23, 2002 → Mar 17, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7410740B2 Magnetic toner for two component developer and image forming method using the same Physics 3 Expired
US6852460B2 Toner and image forming method using the same Physics 2 Expired
US7819159B2 Substrate assembly apparatus and substrate assembly method Physics 2 Active
US7582400B2 Magnetic toner and image forming method using the same Physics 1 Active
US7575840B2 Toner for developing electrostatic latent image and image forming method using the same Physics 1 Active
US8728694B2 Electrostatic latent image-developing toner and method for forming image Physics 1 Active
US6929835B2 Antisolvent-laminate body Emerging Cross-Sectional Technologies 1 Expired
US9383667B2 Electrostatic latent image developing toner Physics 0 Active
US9740128B2 Positively chargeable toner for electrostatic latent image development Physics 0 Active
US8999619B2 Toner for electrostatic latent image development Physics 0 Active
US8980514B2 Toner for electrostatic latent image development Physics 0 Active
US9974216B2 Die supply apparatus Electricity 0 Active
US7575839B2 Magnetic toner for two-component developer and image forming method using the developer Physics 0 Active
US12340331B2 Information processing device and information processing method Electricity 0 Active
US8999620B2 Toner for electrostatic latent image development Physics 0 Active
US8980515B2 Magnetic toner for electrostatic latent image development Physics 0 Active
US9966247B2 Control system and control method for component mounting machine Emerging Cross-Sectional Technologies 0 Active
US9632442B2 Electrostatic latent image developing toner Physics 0 Active
US9887111B2 Die mounting system and die mounting method Electricity 0 Active
US9958799B2 Electrostatic latent image developing toner Physics 0 Active
US8632933B2 Developer for electrostatic latent image development and image forming method Physics 0 Active
US10032650B2 Die mounting system and die mounting method Electricity 0 Active
US11417548B2 Component mounting machine Electricity 0 Active
US11239101B2 Wafer supply device Electricity 0 Active
US11943871B2 Component mounter Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.