Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
US10032658B2 · kind B2 · utility
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2References
14Claims
0Family size
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Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Oct 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a semiconductor device according to the present invention comprises cleaning a semiconductor substrate. A first chemical liquid for forming a water-repellent protection film and a second chemical liquid coating the first chemical liquid are supplied on a surface of the semiconductor substrate. Alternatively, the semiconductor substrate is immersed in the first chemical liquid coated with the second chemical liquid. The semiconductor substrate is then dried.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.