Methods of depositing a metal alloy film
US10036089B2 · kind B2 · utility
4Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Oct 10, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45553
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are methods of depositing films comprising exposing at least a portion of a substrate to a metal precursor to provide a first metal on the substrate and an organometallic reducing agent to deposit a second metal on the substrate to form a mixture or alloy of the first metal and the second metal. Exposure to the metal precursor and organometallic reducing agent can be in either order or simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.