Applied Materials, Inc.
13,598Patents
9,166Active
13,598Granted
61Portfolio score
Filing activity: May 22, 1974 → Oct 30, 2024 · 1,648 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6573030B1 | Method for depositing an amorphous carbon layer | Electricity | 1,088 | Expired |
| US4951601A | Multi-chamber integrated process system | Emerging Cross-Sectional Technologies | 997 | Expired |
| US5558717A | CVD Processing chamber | Emerging Cross-Sectional Technologies | 971 | Expired |
| US5855681A | Ultra high throughput wafer vacuum processing system | Electricity | 948 | Expired |
| US6086677A | Dual gas faceplate for a showerhead in a semiconductor wafer processing system | Chemistry; Metallurgy | 938 | Expired |
| US5937323A | Sequencing of the recipe steps for the optimal low-k HDP-CVD processing | Electricity | 861 | Expired |
| US6387207B1 | Integration of remote plasma generator with semiconductor processing chamber | Electricity | 840 | Expired |
| US6302964A | One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system | Chemistry; Metallurgy | 839 | Expired |
| US6035101A | High temperature multi-layered alloy heater assembly and related methods | Electricity | 835 | Expired |
| US5781693A | Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween | Chemistry; Metallurgy | 809 | Expired |
| US6217658A | Sequencing of the recipe steps for the optimal low-dielectric constant HDP-CVD Processing | Electricity | 794 | Expired |
| US5531835A | Patterned susceptor to reduce electrostatic force in a CVD chamber | Electricity | 790 | Expired |
| US5846332A | Thermally floating pedestal collar in a chemical vapor deposition chamber | Electricity | 782 | Expired |
| US5000113A | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | Electricity | 781 | Expired |
| US5656093A | Wafer spacing mask for a substrate support chuck and method of fabricating same | Emerging Cross-Sectional Technologies | 778 | Expired |
| US7807578B2 | Frequency doubling using spacer mask | Electricity | 750 | Active |
| US6942753B2 | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition | Chemistry; Metallurgy | 741 | Expired |
| US8083853B2 | Plasma uniformity control by gas diffuser hole design | Emerging Cross-Sectional Technologies | 722 | Expired |
| US8328939B2 | Diffuser plate with slit valve compensation | Electricity | 715 | Active |
| US5730801A | Compartnetalized substrate processing chamber | Emerging Cross-Sectional Technologies | 711 | Expired |
| US5186718A | Staged-vacuum wafer processing system and method | Emerging Cross-Sectional Technologies | 700 | Expired |
| US4854263A | Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films | Chemistry; Metallurgy | 693 | Expired |
| US6148761A | Dual channel gas distribution plate | Electricity | 681 | Expired |
| US6878206B2 | Lid assembly for a processing system to facilitate sequential deposition techniques | Electricity | 675 | Expired |
| US6329297A | Dilute remote plasma clean | Emerging Cross-Sectional Technologies | 653 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.