Wafer holder and method for manufacturing the same
US10037910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2016 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Feb 9, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/72
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.