Semiconductor package with coated bonding wires and fabrication method thereof
US10037936B2 · kind B2 · utility
2Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Jun 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3862
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting the semiconductor die to the carrier substrate, an insulating material coated on the bonding wires, and a molding compound covering the top surface and encapsulating the semiconductor die, the plurality of bonding wires, and the insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.