Hsueh-Te Wang
11Patents
6h-index
13Co-inventors
63Inventor score
Filing activity: May 24, 1999 → Jun 13, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6258626A | Method of making stacked chip package | Electricity | 92 | Expired |
| US6768190B2 | Stack type flip-chip package | Electricity | 77 | Expired |
| US7034388B2 | Stack type flip-chip package | Electricity | 44 | Expired |
| US6153939A | Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same | Electricity | 15 | Expired |
| US7253508B2 | Semiconductor package with a flip chip on a solder-resist leadframe | Electricity | 10 | Expired |
| US7164202B2 | Quad flat flip chip package and leadframe thereof | Electricity | 8 | Expired |
| US7067904B2 | Flip-chip type quad flat package and leadframe | Electricity | 6 | Expired |
| US10037936B2 | Semiconductor package with coated bonding wires and fabrication method thereof | Electricity | 2 | Active |
| US7022551B2 | Quad flat flip chip packaging process and leadframe therefor | Electricity | 1 | Expired |
| US10685943B2 | Semiconductor chip package with resilient conductive paste post and fabrication method thereof | Electricity | 0 | Active |
| US10978406B2 | Semiconductor package including EMI shielding structure and method for forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.