Manufacturing method for metallic housing of electronic device
US10040120B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 29, 2016 |
| Grant date | Aug 7, 2018 |
| Priority date | — |
| Expiry date | Apr 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/3888
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.