Chen-Shen Lin
8Patents
2h-index
7Co-inventors
40Inventor score
Filing activity: Oct 3, 2006 → May 23, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7460370B2 | Heat dissipation assembly | Mechanical Engineering; Lighting; Heating | 12 | Active |
| US7537049B2 | Heat dissipation apparatus | Electricity | 5 | Active |
| US9370823B2 | Metallic housing of electronic device and manufacturing method thereof | Electricity | 1 | Active |
| US7740050B2 | Mold for manufacturing heat dissipation apparatus | Performing Operations; Transporting | 0 | Active |
| US10124405B2 | Manufacturing method for metallic housing of electronic device | Electricity | 0 | Active |
| US10040120B2 | Manufacturing method for metallic housing of electronic device | Electricity | 0 | Active |
| US9358606B2 | Metallic housing of electronic device and manufacturing method thereof | Electricity | 0 | Active |
| US9901979B2 | Metallic article and method for manufacturing metallic article | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.