Carrier-substrate adhesive system
US10046550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2016 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jun 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.