Polymer composite thermal interface material with high thermal conductivity
US10047264B2 · kind B2 · utility
1Cited by
10References
11Claims
0Family size
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Inventor
Key dates
| Filing date | Nov 18, 2014 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | May 8, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2270/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates generally to thermally conductive adhesives for thermal interfaces in electronic packaging, and more particularly, to a polymer-based composite thermal interface material (“TIM”) with an inter-penetrating network (IPN) polymer matrix consisting of polyurethane and an epoxy that is fully crosslinked. The IPN polymer matrix is designed to improve overall thermal conductivity by the altering the dispersion/distribution of thermally conductive fillers, the filler/polymer interfaces, and/or phonon scattering behaviors in the composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.