Inventor · Albany, NY, US

Wei Lin

36Patents
5h-index
30Co-inventors
65Inventor score

Filing activity: May 29, 2012 → Jan 13, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9620481B2 Substrate bonding with diffusion barrier structures Electricity 197 Active
US9064937B2 Substrate bonding with diffusion barrier structures Electricity 23 Active
US9466538B1 Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process Electricity 9 Active
US9054109B2 Corrosion/etching protection in integration circuit fabrications Electricity 7 Active
US9028628B2 Wafer-to-wafer oxide fusion bonding Electricity 7 Active
US9922851B2 Gas-controlled bonding platform for edge defect reduction during wafer bonding Electricity 5 Active
US9059039B2 Reducing wafer bonding misalignment by varying thermal treatment prior to bonding Electricity 5 Active
US9401303B2 Handler wafer removal by use of sacrificial inert layer Electricity 4 Active
US9806032B1 Integrated circuit structure with refractory metal alignment marker and methods of forming same Electricity 4 Active
US9263366B2 Liquid cooling of semiconductor chips utilizing small scale structures Electricity 4 Active
US9058974B2 Distorting donor wafer to corresponding distortion of host wafer Emerging Cross-Sectional Technologies 3 Active
US10157757B2 Gas-controlled bonding platform for edge defect reduction during wafer bonding Electricity 3 Active
US9536853B2 Semiconductor device including built-in crack-arresting film structure Emerging Cross-Sectional Technologies 3 Active
US9263389B2 Enhancing barrier in air gap technology Electricity 3 Active
US10056272B2 Gas-controlled bonding platform for edge defect reduction during wafer bonding Electricity 2 Active
US10047264B2 Polymer composite thermal interface material with high thermal conductivity Chemistry; Metallurgy 1 Active
US11586314B1 Border touch module Physics 1 Active
US10170447B2 Advanced chip to wafer stacking Electricity 1 Active
US9059333B1 Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding Electricity 1 Active
US9881896B2 Advanced chip to wafer stacking Electricity 1 Active
US10211178B2 Semiconductor device including built-in crack-arresting film structure Emerging Cross-Sectional Technologies 0 Active
US9640514B1 Wafer bonding using boron and nitrogen based bonding stack Electricity 0 Active
US9142488B2 Manganese oxide hard mask for etching dielectric materials Emerging Cross-Sectional Technologies 0 Active
US10276500B2 Enhancing barrier in air gap technology Electricity 0 Active
US11829546B2 Border touch module Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.