Method and system for tool condition monitoring based on a simulated inline measurement
US10047439B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Dec 8, 2011 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.