Wafer processing method
US10049934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Oct 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.